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Maskless Lithography UV Laser Writer | SIMTRUM Photonics Store

Maskless Lithography UV Laser Writer

 

SIMTRUM's maskless lithography enables nanopatterning at will, without the need for slow and expensive photomask. This convenience is especially useful for research and rapid prototyping use. Our system compliments the existing benefits by bringing it to the desktop without any compromise in performance.

 

The Beam Engine focuses a UV laser beam into a diffraction-limited spot and scans the spot to expose any arbitrary pattern on a photoresist. To expose large wafers, precision steppers move the wafer and allows multiple exposures to be stitched. The Beam Engine is capable of producing features smaller than (CD) 0.5 µm across a 8 wafer.

 

* We have a new option for you now - the BEAM Lite. At a lower price, you can get the best-fitting product. Contact us for more details.

Request for Demo or Sample Measurement

Please contact us: info@simtrum.com

  • Compact Full-featured maskless lithography, smaller than a desktop computer.
  • Powerful Sub-micron resolution while exposes a writefield in less than two seconds.
  • Ultrafast Autofocus Piezo actuators reach focus in less than a second when combined with our closed-looped focus optics.
  • No-fuss Multilayer Semi-automatic alignment allows multilayer alignment to be completed within minutes.

 

Measurement Example

Split-ring resonator arrays. The distance on the right is 1.5 µm (arrow), 
separation distance on the left is 2 µm. The outer ring is 80 µm across. 

Array of resist micropatterns on silicon substrate. Each cell is 50 ✕ 63 µm, 
with 3 µm spacing between adjacent patterns. Resist used: AZ5214E

 

0.8 µm tapered middle section with 20 ✕ 90 µm contact pads on the side. 
Resist used: AZ5214E

 

Square with 500 nm linewidth

Resist: KL5302

 

Microcoils and other patterns at 2 μm linewidth

Resist: 5 μm dry film

 

Interdigitated Capacitors (IDCs) with 2 µm fingers.

Resist used: AZ5214E

 

 

Software Features

  1. The included software makes quick work of any patterning job; just load, align and expose. Navigation is similar to CNC systems.
  2.  
  3. During multilayer exposures, the GDS pattern is overlaid for visualization. The control GUI (left window) has a minimap of the loaded GDS that allows navigation to any area on the wafer with 1-click.

    Xplorer Main Window

    Softwear_Xploer_Main_Window.jpg

     

    Camera Window

    Camera_Window.jpg

    Acts as a minimap of the entire sample stage. Loaded patterns and exposed areas can be viewed. The black bos shows the regin that the BEAM ENGINE is currently at.
    The live video stream on the camera window also corresponds to the same area.

     

    The camera window shows a live stream of what the BEAM ENGINE is looking at.
    The camera window also plays an important role during alignment, where the chosen alignment features appear overlaid on the amera stream.

 

Patterning Processing

 SIMTRUM BEAM was desinged so that the least number of steps are necessary to do a full exposure. Depending on the complexity of the patteming job, it is possible to load, align and expose a pattern onto a wafer in under 3 minutes. the flow of the entire patterning process is as shown below:

Patterning.jpg

 


Product Upgrade

  • DMD replaces laser galvanometers
  • Interchangeable lens design (0.5 μm resolution or 200 mm²/min)
  • True 8-bit grayscale lithography for advanced 2.5D and 3D microstructure fabrication
  • Single writefield exposures as fast as 250 ms 
  • Gradient stitching supports a maximum overlap rate of 100% 
  • Low maintenance: Solid-state architecture reduces moving parts and wear. 80% reduction in required calibrations, minimizing downtime and maintenance costs

 

Specifications

Product Model  LL-LW-405-4-0.8* LL-LW-405-6-0.8*
Repeatability  0.1 μm
Autofocus  Piezo-actuated; fast and precise (20 nm) focus
Compatible with most transparent substrates 
Wafer Alignment  Automatic Wafer Alignment 
Topside only  Topside and buttom (optional) 
Maximum Writing Area  106×106 mm 150×150 mm (8”optional)
Maximum Sample Size  130 mm ✕ 130 mm ( 5”compatible) 155 mm ✕ 155 mm ( 6”compatible)
Sample Mounting  Friction mount (optional: porous vaccum chuck)
Weight 20 kg 27 kg
System Size  330×310×340 mm 342×385×338 mm
Objectives   50×
LL-LW-50
20×*
LL-LW-20
10×*
LL-LW-10

LL-LW-5
Minumum Linewidth (μm)  0.5 0.8 1.5 3
Patterning Speed (mm2/min)  3 15 60 200
Laser Exposure Wavelength (nm)  405 nm (365/385 nm optional)
Software-selectable Dual Wavelength (optional)
Grayscale  8-bit (16-bit optional)
Software Accepted File Formats  .bmp, .png, .tiff, .dxf, .gds
Patterns can directly be drawn in software
Patterning  Beam Xplorer
Drawing KLayout (most powerful), AutoCAD 
 
*For LL-LW-405-4-0.8 and LL-LW-405-6-0.8 products, the standard configuration includes a 20× objective lens. For other objective lenses (e.g., 50×), please contact SIMTRUM.
*For the LL-LW-405-4-1.5 (cost-effective) product, a 10× objective lens is standard. For other objective lenses (e.g., 5×), please contact SIMTRUM.
 
 
Backside Alignment for LL-LW-405-6-0.8 (Optional)

 

SIMTRUM's back-side alignment technology is achieved through two cameras and proprietary computer vision software. These two upward-facing cameras are arranged at a fixed distance, enabling them to capture alignment marks on the bottom surface of the wafer.

 

 

Each backside alignment system comes with a calibration wafer, and a self calibration software.

 

 

Note: backside alignment option must be purchased with system and is not available as an upgrade

Camera  5 MP Sony Sensor
Field of View 2000 μm
Pixel Resolution 1 μm
Illumination 570 nm
Alignment Resolution  0.1 μm
Alignment Accuracy <2 μm
Camera Separation Customizable from 80 to 135 mm
Compatibility  Only for LL-LW-405-6-0.8

 

Product_Front_View.jpg

Front View

 

Product_Back_View.png

Back View

Modular optics.jpg

    Modular Laser Head

      Swappable optics minimizes downtime and increases upgradeability.

      Customization options are available for different wavelengths and write 

      field sizes. Contact us info@simtrum.comfor more info.

System Requirements 

 

Power 

BEAM opeartes on 100-240 VAC 50-60j Hz. Line voltage and frequency are automatically sensed; therefore, no swithces are to be set. Check that the operating voltagein your area is compatible. 

 

Location 

●  Indoor, dust free, near-non-conductive pollution (degree 2 of EN61010-1:2010) 

●  Tabletop vibration should be kept under VC-A (50 um/s) 

●  Cleanroom environment is optional  (Vibration Reference link)

●  Equipment must be shaded from indirect sunlight 

●  Relative humidity < 80% (no condensation) 

 


If you need our technical team for guidance on product selection or customization, please help to provide below technical information, it helps to speed up the process.

 

Items Detail Unit Remark
Application      
Working Wavelength   nm  
Linewidth   nm  
Patterning Speed   mm2/min  
Sample Size   mm  
Grayscale   bit 8-bit or 16-bit

 

 

We are here for you!

 

 

 

Drop us an email at info@simtrum.com to get the Best Price today.   Want more technical information? Click Here for the professional Customized System/ Solutions.
     

 

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Search Reset
Compare Model Drawings & Specs Availability Reference Price
(USD)
LL-LW-405-4-0.8
Repeatability: 0.1 μm ,Stage Travel: 4"", 5"" compatible, Laser Wavelength: 405 nm (365/385 nm optional) ,Default Configuration: 20x. (0.8 μm, 15 mm²/min) ,Grayscale: 8-bit, 2K DMD resolution, Delivered with high performance laptop
6-10 Weeks Request for quote
LL-LW-405-6-0.8
Repeatability: 0.1 μm ,Stage Travel: 6"" (8"" optional) ,Laser Wavelength: 405 nm (365/385 nm optional) ,Default Configuration: 20x. (0.8 μm, 15 mm²/min), Grayscale: 8-bit, 2K DMD resolution ,Delivered with high performance laptop
6-10 Weeks Request for quote
LL-LW-405-4-1.5
Repeatability: 0.1 μm, Stage Travel: 4"" ,Laser Wavelength: 405 nm (365/385 nm optional) ,Default Configuration: 10x. (1.5 μm, 60 mm²/min) ,Grayscale: 8-bit, 2K DMD resolution ,Delivered with high performance laptop
6-10 Weeks Request for quote
LL-LW-405-6-0.8-Upgrade
Repeatability: 0.1 μm ,Stage Travel: 8"" ,Laser Wavelength: 405 nm (365/385 nm optional) ,Default Configuration: 20x. (0.8 μm, 15 mm²/min), Grayscale: 8-bit, 2K DMD resolution, Delivered with high performance laptop
6-10 Weeks Request for quote

LL-LW-Vacuum - Parameter

LL-LW-BSA - Parameter

LL-LW-50 - Parameter

LL-LW-20 - Parameter

LL-LW-10 - Parameter

LL-LW-5 - Parameter

LL-LW-2.5 - Parameter

LL-LW-Upgrade - Parameter

LL-LW-405-6-0.8-Upgrade - Parameter

LL-LW-405-4-1.5 - Parameter

LL-LW-405-6-0.8 - Parameter

LL-LW-405-4-0.8 - Parameter

LL-LW-Vacuum - Download

LL-LW-BSA - Download

LL-LW-50 - Download

LL-LW-20 - Download

LL-LW-10 - Download

LL-LW-5 - Download

LL-LW-2.5 - Download

LL-LW-Upgrade - Download

LL-LW-405-6-0.8-Upgrade - Download

LL-LW-405-4-1.5 - Download

LL-LW-405-6-0.8 - Download

LL-LW-405-4-0.8 - Download

Accessories

Compare Model Drawings & Specs Availability Reference Price
(USD)
LL-LW-Upgrade
Dual Light Source: 405 nm+365 nm (Software selectable) ,Grayscale: 16-bit, 3K DMD resolution
6-10 Weeks Request for quote
LL-LW-2.5
Linewidth: 6 μm
6-10 Weeks Request for quote
LL-LW-5
Linewidth: 3 μm ,Patterning Speed: 200 mm2/min
6-10 Weeks Request for quote
LL-LW-10
Linewidth: 1.5 μm ,Patterning Speed: 60 mm2/min
6-10 Weeks Request for quote
LL-LW-20
Linewidth: 0.8 μm, Patterning Speed: 15 mm2/min
6-10 Weeks Request for quote
LL-LW-50
Linewidth: 0.5 μm ,Patterning Speed: 3 mm2/min
6-10 Weeks Request for quote
LL-LW-BSA
Only for LL-LW-405-6-0.8 ,Enables two-point alignment ,Alignment accuracy: < 2 um, Please confirm microscope placement before placing order
6-10 Weeks Request for quote
LL-LW-Vacuum
Perforated sample stage to allow for vacuum-based workholding, Vacuum pump not included
6-10 Weeks Request for quote