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UV Laser Writer - Maskless Lithography BEAM Lite

Maskless Lithography UV Direct Laser Writer system, minimum linewidth 3µm guaranteed, 2 µm achievable, minimum pitch 4 µm achievable, exposure time < 2 s for 1 writefield, maximum writefield 800 µm ✕ 800 µm, laser power 40mW, laser wavelength 375/405nm

MODEL:UV Laser Writer - Maskless Lithography BEAM Lite

6-10 Weeks Drawings

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* The prices are indicative only. Please contact us for an official quote. This is single product page, for detail specification please refer to product main page


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UV Laser Writer - Maskless Lithography BEAM
Maskless Lithography UV Direct Laser Writer system, minimum linewidth 2um guaranteed, 0.8 µm achievable, minimum pitch 1.6 µm achievable, exposure time < 2 s for 1 writefield, maximum writefield 400 µm ✕ 400 µm, laser power 40mW, laser wavelength 405nm
6-10 Weeks Request for quote

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Compare Model Drawings & Specs Availability Reference Price

Product Specification


ParametersBEAMBEAM Lite
Minimum Linewidth最小线宽

2 µm guaranteed,  0.8 µm achievable (0.8µm可实现)

3 µm guaranteed,  2 µm achievable (2µm可实现)

Minimum Pitch 最小间距

1.6 µm achievable(可达到1.6 µm)4 µm achievable (可达到4 µm)

Exposure Time 曝光时间

< 2 s for 1 writefield(1个图案<2s)

Maximum Writefield 最大写场

400 µm ✕ 400 µm800 µm ✕ 800 µm

Laser Power 激光能量

40mW(Customizble可定制)

Laser Wavelength 激光波长

405 nm375/405 nm

Laser Galvo 激光振镜

Step Size 步径

8 nm

Repeatability 重复性

< 100 nm (static)

Speed 速度

up to 200 mm/s

Motorized Stepper 

电动平台

Encoder Resolution 编辑器分辨率

0.1 µm

Stage Repeatability (1σ)载物台重复性

Better than 0.3 µm (优于 0.3 µm)

Movement Area 移动区域

120 mm ✕ 120 mm

Largest Sample Size 最大样本尺寸

130 mm ✕ 130 mm (> 5”)

Wafer Alignment 晶圆对齐 

Multilayer processes supported  支持多层工艺

Single-layer processes supported*   支持单层工艺*

Accepted File Formats 接受的文件格式.bmp, .png, .tiff, .gds, Custom shapes can directly be drawn   in software. 自定义形状可以直接在软件中绘制

Software 软件 

Patterning 图案

Nanyte BEAM Xplorer

Design 设计

KLayout (most powerful最强大),   MS Paint/Powerpoint (rapid prototyping快速原型设计)

Weight 重量

Lighter than 20 kg 少于20公斤

System Size 系统尺寸

330 ✕ 310 ✕ 340 mm

* For more information about upgrading to Multilayer Processes, please contact us. 可升级为支持多层工艺,请联系我们了解更多资讯。


                                      

Product_Front_View.jpg

Front View

   






Product_Back_View.png

Back View




Modular optics.jpg

    Modular Laser Head


      Swappable optics minimizes downtime and increases upgradeability.

      可更换的光学元件可最大限度地减少停机时间并提高可升级性。


      Customization options are available for different wavelengths and write 

      field sizes. Contact us info@simtrum.comfor more info.

      定制选项可用于不同的波长和写场大小。联系我们 info@simtrum.com

      了解更多信息 。




System Requirements 


Power 功率

BEAM opeartes on 100-240 VAC 50-60j Hz. Line voltage and frequency are automatically sensed; therefore, no swithces are to be set. Check that the operating voltagein your area is compatible. BEAM 在 100-240 VAC 50-60j Hz 上运行。 自动感应线路电压和频率; 因此,无需设置任何开关。 检查您所在地区的工作电压是否兼容。


Location 放置环境

●  Indoor, dust free, near-non-conductive pollution (degree 2 of EN61010-1:2010) 室内、无尘、近非导电污染(EN61010-1:2010 2 级)

●  Tabletop vibration should be kept under VC-A (50 um/s) 桌面振动应保持在 VC-A (50 um/s) 以下

●  Cleanroom environment is optional 非超净间环境下可使用 (Vibration Reference link)

●  Equipment must be shaded from indirect sunlight 设备必须避免阳光直射

●  Relative humidity < 80% (no condensation) 相对湿度 < 80%(无冷凝)



UV Laser Writer - Maskless Lithography BEAM Lite - Parameter

UV Laser Writer - Maskless Lithography BEAM - Parameter

UV Laser Writer - Maskless Lithography BEAM Lite - Download

UV Laser Writer - Maskless Lithography BEAM - Download